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Tool
Holtek Semiconductor USA Inc. 19 Hammond Suite 513 Irvine CA 92618 USA 949-273-8988
Copyright 2017. Holtek Semiconductor USA Inc. All Rights Reserved.
BC66V840

D1002C

D1003C

D1062A

D1070A

D1091A

D2004C

D2005A

e-FADP08N

e-FADP10M

e-FADP10M2

e-FADP10N3

e-Link

e-Link32 Pro

ESK-302

ESK32-20001
OCDS chip for BC66F840

DEV development daughter board

DEV development daughter board

DEV development daughter board

DEV development daughter board

DEV development daughter board

DEV development daughter board

DEV development daughter board

The e-FADP08N will transform the 16NSOP EV
package type into an 8SOP package type
The e-FADP10M will transform the 16NSOP EV
package type into a 10MSOP package type
The e-FADP10M2 will transform the 16NSOP EV
package type into a 10MSOP package type
The e-FADP10N3 will transform the 16NSOP EV
package type into a 10SOP package type
development board for 8 bit MCU core

development board for 32bit ARM core

8bit MCU Starter Kit (e-Link Lite + HT66V70A)
http://www.holtek.com/esk-302
HT32 Expansion Board
$5

$45

$45

$45

$45

$45

$45

$45

$3.5

$3.5

$3.5

$3.5

$49

$32

$28

$55
PART NUMBER
32QFN

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DESCRIPTION
PRICE